Description
The Scalable HCI Research Symposium is designed to cross pollinate dialogues on Hardware in Human-Computer Interaction (HCI), while showcasing Shenzhen's potential as a global innovation hub. Drawing inspiration from influential figures in Open Hardware and Hackerspace movements, like Bunnie Huang and Mitch Altman, the symposium emphasizes the democratization of access to Shenzhen's manufacturing power. This focus is particularly beneficial for communities in developing countries as it amplifies financial accessibility to hardware, but it also paves the way for scaling research to unprecedented dimensions and unexplored territories. In collaboration with leading open hardware industry partners such as Seeed, the symposium provides invaluable insights into these manufacturing intricacies.
Scalable HCI Symposium 2025 takes place in Shenzhen, China, from 6 to 10 January 2025.
Language
English
Category
Short-Term Study Programs
Program Theme
Engineering
Field
Human-Computer Interaction (HCI)
Degree Requirement
Master
Enrollment Number
80
Length
5 days
Admission
All international students with (or expected to obtain) a Master's are welcome to apply.
1. Demos & Posters session
This session is designed to allow participants from various backgrounds to introduce their research to each other. The topic can be anything related to HCI and research at scale. This will be non-archival as in other SIGCHI demo/poster sessions, but if participants introduce new work, the posters will not be published.
2. Demos
This is the most exciting part, please consider demonstrating your work, even a non-functional artifact. After describing your proposal in your application, the organizers will contact you to help you set up your demo.
3. Posters
Size: Height 170 cm × Width 120 cm, PDF format
Printing: The symposium team will do it for all the posters.
Time
January 6, 2025 - January 10, 2025
Credit
No
Financial Aids
No
Fees
Registration fee: Free for all.
Contact
Name: Ms. Yuqi Tong, 佟雨琪
Title: Program officer
Tel: +86-0755-88012831
E-mail: tongyq@mail.sustech.edu.cn
Online Application Login
Application Deadline
November 30, 2024