YES Project > Scalable HCI Symposium 2025
Scalable HCI Symposium 2025
Release time : 16/12/2024 Update Time : 24/12/2024

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Description

The Scalable HCI Research Symposium is designed to cross pollinate dialogues on Hardware in Human-Computer Interaction (HCI), while showcasing Shenzhen's potential as a global innovation hub. Drawing inspiration from influential figures in Open Hardware and Hackerspace movements, like Bunnie Huang and Mitch Altman, the symposium emphasizes the democratization of access to Shenzhen's manufacturing power. This focus is particularly beneficial for communities in developing countries as it amplifies financial accessibility to hardware, but it also paves the way for scaling research to unprecedented dimensions and unexplored territories. In collaboration with leading open hardware industry partners such as Seeed, the symposium provides invaluable insights into these manufacturing intricacies. 

Scalable HCI Symposium 2025 takes place in Shenzhen, China, from 6 to 10 January 2025.



Language

English



Category

Short-Term Study Programs



Program Theme

Engineering



Field

Human-Computer Interaction (HCI)



Degree Requirement

Master



Enrollment Number

80

Length

5 days



Admission

All international students with (or expected to obtain) a Master's are welcome to apply.

1. Demos & Posters session

This session is designed to allow participants from various backgrounds to introduce their research to each other. The topic can be anything related to HCI and research at scale. This will be non-archival as in other SIGCHI demo/poster sessions, but if participants introduce new work, the posters will not be published.

2. Demos

This is the most exciting part, please consider demonstrating your work, even a non-functional artifact. After describing your proposal in your application, the organizers will contact you to help you set up your demo.

3. Posters 

Size: Height 170 cm × Width 120 cm, PDF format 

Printing: The symposium team will do it for all the posters.



Time

January 6, 2025 - January 10, 2025



Credit

No



Financial Aids

No



Fees

Registration fee: Free for all.



Contact

Name: Ms. Yuqi Tong, 佟雨琪

Title: Program officer

Tel: +86-0755-88012831

E-mail: tongyq@mail.sustech.edu.cn



Online Application Login



Application Deadline

November 30, 2024